Duh, Jenq Gong: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Processing silicon microparticles recycled from wafer waste via Rapid Thermal Process for lithium-ion battery anode materials

Tan, Hui-Gee, Duh, Jenq-Gong

Journal:

Journal of Power Sources

Year:

2016

Language:

english

File:

PDF, 2.86 MB

english, 2016

2

Influences of target poisoning on the mechanical properties of TiCrBN thin films grown by a superimposed high power impulse and medium-frequency magnetron sputtering

Lu, Chi-Yu, Diyatmika, Wahyu, Lou, Bih-Show, Lu, Yu-Chu, Duh, Jenq-Gong, Lee, Jyh-Wei

Journal:

Surface and Coatings Technology

Year:

2017

Language:

english

File:

PDF, 909 KB

english, 2017

3

Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping

Tsai, Yi-Da, Yu, Chi-Yang, Hu, Chi-Chang, Duh, Jenq-Gong

Journal:

Journal of The Electrochemical Society

Year:

2012

Language:

english

File:

PDF, 317 KB

english, 2012

4

Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode

Wu, Cheng-Yu, Chang, Chun-Chi, Duh, Jenq-Gong

Journal:

Journal of Power Sources

Year:

2016

Language:

english

File:

PDF, 2.26 MB

english, 2016

5

Stress and oxidation behaviours of r.f.-sputtered (Ti,Al)N films

Chi-Tung Huang, Jenq-Gong Duh

Journal:

Surface and Coatings Technology

Year:

1996

Language:

english

File:

PDF, 630 KB

english, 1996

6

Oxidation behavior of Si-doped nanocomposite CrAlSiN coatings

Hsien-Wei Chen, Yu-Chen Chan, Jyh-Wei Lee, Jenq-Gong Duh

Journal:

Surface and Coatings Technology

Year:

2010

Language:

english

File:

PDF, 1.30 MB

english, 2010

7

Effect of grain size on mechanical properties in CrAlN/SiNx multilayer coatings

Chih-Hsiung Lin, Yan-Zuo Tsai, Jenq-Gong Duh

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 481 KB

english, 2010

8

Tribological behavior of CrAlSiN/W2N multilayer coatings deposited by DC magnetron sputtering

Yan-Zuo Tsai, Jenq-Gong Duh

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 707 KB

english, 2010

9

Indentation behavior and Young's modulus evaluation in electroless Ni modified CrN coating on mild steel

Jiann-Shiung Chen, Jenq-Gong Duh

Journal:

Surface and Coatings Technology

Year:

2001

Language:

english

File:

PDF, 551 KB

english, 2001

10

Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate

Bi-Shiou Chiou, Jiann-Haur Chang, Jenq-Gong Duh

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1995

Language:

english

File:

PDF, 380 KB

english, 1995

11

Fabrication and properties of alumino-borosilicate glass-ceramic systems

Bi-Shiou Chiou, Jyh-Ming Tzeng, Jenq-Gong Duh

Journal:

Journal of Materials Science: Materials in Electronics

Year:

1993

Language:

english

File:

PDF, 363 KB

english, 1993

12

Corrosion of aluminium nitride substrates in acid, alkaline solutions and water

Chung -Daw Young, Jenq -Gong Duh

Journal:

Journal of Materials Science

Year:

1995

Language:

english

File:

PDF, 3.75 MB

english, 1995

13

Determination of the Diffusivity of Point Defects in Passive Films on NiTi and NiTiAl Alloys

Kuan-Ting Liu, Jenq-Gong Duh

Journal:

Journal of Phase Equilibria and Diffusion

Year:

2010

Language:

english

File:

PDF, 799 KB

english, 2010

14

The effect of substrate surface roughness on the wettability of Sn-Bi solders

Yi-Yu Chen, Jenq-Gong Duh, Bi-Shiou Chiou

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2000

Language:

english

File:

PDF, 177 KB

english, 2000

15

Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints

Hui-Wei Miao, Jenq-Gong Duh, Bi-Shiou Chiou

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2000

Language:

english

File:

PDF, 269 KB

english, 2000

16

Synthesis of entanglement structure in nanosized Li4Ti5O12/multi-walled carbon nanotubes composite anode material for Li-ion batteries by ball-milling-assisted solid-state reaction

Yi Ruei Jhan, Jenq Gong Duh

Journal:

Journal of Power Sources

Year:

2012

Language:

english

File:

PDF, 837 KB

english, 2012

17

Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging

Hui-Wei Miao, Jenq-Gong Duh

Journal:

Materials Chemistry and Physics

Year:

2001

Language:

english

File:

PDF, 5.73 MB

english, 2001

18

Fracture toughness and hardness of ceria- and yttria-doped tetragonal zirconia ceramics

Jyung-Dong Lin, Jenq-Gong Duh

Journal:

Materials Chemistry and Physics

Year:

2003

Language:

english

File:

PDF, 473 KB

english, 2003

19

High In-Plane Magnetic Anisotropy and Microwave Frequency Performance of Soft Magnetic (FeCo)(AlO) Films Prepared by Modified Composition Gradient Sputtering

Shandong Li, Ming Liu, Lou, J., Xing, X., Zhijuan Su, Ziyao Zhou, Feng Xu, Jenq-Gong Duh, Sun, N.X.

Journal:

IEEE Transactions on Magnetics

Year:

2011

Language:

english

File:

PDF, 505 KB

english, 2011

20

Structure and mechanical property evaluation of Cr–Ti–B–N coatings

Ho, Li-Wei, Lee, Jyh-Wei, Chen, Hsien-Wei, Chan, Yu-Chen, Duh, Jenq-Gong

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 449 KB

english, 2013

21

Electrochemical characterization of Zr-based thin film metallic glass in hydrochloric aqueous solution

Chuang, Ching-Yen, Liao, Yi-Chia, Lee, Jyh-Wei, Li, Chia-Lin, Chu, Jinn P., Duh, Jenq-Gong

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 1.07 MB

english, 2013

22

Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

Tseng, Chien-Fu, Duh, Jenq-Gong

Journal:

Materials Science and Engineering: A

Year:

2013

Language:

english

File:

PDF, 2.23 MB

english, 2013

23

Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass

Chen, Hsien-Wei, Hsu, Kai-Chieh, Chan, Yu-Chen, Duh, Jenq-Gong, Lee, Jyh-Wei, Jang, Jason Shian-Ching, Chen, Guo-Ju

Journal:

Thin Solid Films

Year:

2014

Language:

english

File:

PDF, 958 KB

english, 2014

24

Modification of structure and property in Zr-based thin film metallic glass via processing temperature control

Chu, Jia-Hong, Chen, Hsien-Wei, Chan, Yu-Chen, Duh, Jenq-Gong, Lee, Jyh-Wei, Jang, Jason Shian-Ching

Journal:

Thin Solid Films

Year:

2014

Language:

english

File:

PDF, 1.56 MB

english, 2014

25

Synthesis of confinement structure of Sn/C-C (MWCNTs) composite anode materials for lithium ion battery by carbothermal reduction

Jhan, Yi-Ruei, Duh, Jenq-Gong, Tsai, Su-Yueh

Journal:

Diamond and Related Materials

Year:

2011

Language:

english

File:

PDF, 1.02 MB

english, 2011

26

Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

Wu, Yi-Hsin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-Gong

Journal:

Materials Letters

Year:

2013

Language:

english

File:

PDF, 850 KB

english, 2013

27

The influence of boron contents on the microstructure and mechanical properties of Cr–B–N thin films

Lee, Jyh-Wei, Chih-Hong, Cheng, Chen, Hsien-Wei, Ho, Li-Wei, Duh, Jenq-Gong, Chan, Yu-Chen

Journal:

Year:

2013

Language:

english

File:

PDF, 692 KB

english, 2013

28

Texture, microstructure and anti-wear characteristics in isostructural CrAlSiN/W2N multilayer coatings

Chan, Yu-Chen, Chen, Hsien-Wei, Tsai, Yan-Zuo, Duh, Jenq-Gong, Lee, Jyh-Wei

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 1021 KB

english, 2013

29

Adhesion strength and microstructural evaluation in electroless Ni-P metallized AlN substrate

Chung-Daw Young,, Jenq-Gong Duh,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1997

Language:

english

File:

PDF, 438 KB

english, 1997

30

Indirect bonding of Ni-electroless plated AlN and Cu by hot pressing method

Chung-Daw Young,, Jenq-Gong Duh,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1994

Language:

english

File:

PDF, 941 KB

english, 1994

31

One-step argon/nitrogen binary plasma jet irradiation of Li4Ti5O12 for stable high-rate lithium ion battery anodes

Lan, Chun-Kai, Chuang, Shang-I., Bao, Qi, Liao, Yen-Ting, Duh, Jenq-Gong

Journal:

Journal of Power Sources

Year:

2015

Language:

english

File:

PDF, 2.28 MB

english, 2015

32

Large Field-Induced Magnetocaloric Effect in Ni$_{43}$Mn$_{46 - {\rm x}}$V$_{\rm x}$Sn$_{11}$ Heusler Alloys

Li, Shandong, Lin, Zhiping, Wang, Zeng, Xu, Jie, Wang, Lili, Lin, Jianhua, Hu, Yi, Xu, Feng, Nan, TianXiang, Sun, Nian X., Duh, Jenq-Gong

Journal:

IEEE Transactions on Magnetics

Year:

2012

Language:

english

File:

PDF, 747 KB

english, 2012

33

Microwave Frequency Performance and High Magnetic Anisotropy of ${\rm Fe}_{70}{\rm Co}_{30}-{\rm B}$ Films Prepared by a Modified Composition Gradient Sputtering

Li, Shandong, Wang, Lili, Xu, Jie, Wang, Zeng, Liu, Ming, Lou, J., Beguhn, S., Nan, Tianxiang, Xu, Feng, Sun, Nian X., Duh, Jenq-Gong

Journal:

IEEE Transactions on Magnetics

Year:

2012

Language:

english

File:

PDF, 597 KB

english, 2012

34

Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate

Bi-Shiou Chiou,, Jiann-Haur Chang,, Jenq-Gong Duh,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Year:

1995

Language:

english

File:

PDF, 580 KB

english, 1995

35

Interdiffusion in Fe-Ni-Cr Alloys at 100°C

Duh, Jenq Gong, Dayananda, Mysore A.

Journal:

Defect and Diffusion Forum

Year:

1985

Language:

english

File:

PDF, 1.14 MB

english, 1985

36

Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test

Lin, Hsiu-Min, Ho, Cheng-Ying, Chen, Wen-Lin, Wu, Yi-Hsin, Wang, De-Hui, Lin, Jun-Ren, Wu, Yu-Hui, Hong, Huei-Cheng, Lin, Zhi-Wei, Duh, Jenq-Gong

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.86 MB

english, 2015

37

Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies

Chen, Wei-Yu, Chou, Tzu-Ting, Tu, Wei, Chang, Hsiang-Ching, Lee, Christine Jill, Duh, Jenq-Gong

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 1.05 MB

english, 2015

38

Novel Composite Anode Containing Tin Compounds and Carbonaceous Materials for Li-Ion Batteries

Fang, Ting, Hsiao, Li Yin, Duh, Jenq Gong

Journal:

Key Engineering Materials

Year:

2007

Language:

english

File:

PDF, 3.92 MB

english, 2007

39

Influence of Si contents on tribological characteristics of CrAlSiN nanocomposite coatings

Chang, Chun-Chi, Chen, Hsien-Wei, Lee, Jyh-Wei, Duh, Jenq-Gong

Journal:

Thin Solid Films

Year:

2015

Language:

english

File:

PDF, 900 KB

english, 2015

40

Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints

Chen, Wen-Lin, Yu, Chi-Yang, Ho, Cheng-Ying, Duh, Jenq-Gong

Journal:

Materials Science and Engineering: A

Year:

2014

Language:

english

File:

PDF, 9.58 MB

english, 2014

41

Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes

Chuang, Shang-I, Yang, Hao, Chen, Hsien-Wei, Duh, Jenq-Gong

Journal:

Thin Solid Films

Year:

2015

Language:

english

File:

PDF, 1.55 MB

english, 2015

42

Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging

Bailey, Christopher, Hsiao, Li‐Yin, Duh, Jenq‐Gong

Journal:

Soldering & Surface Mount Technology

Year:

2006

Language:

english

File:

PDF, 532 KB

english, 2006

43

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Lee, Christine Jill, Chen, Wei-Yu, Chou, Tzu-Ting, Lee, Tae-Kyu, Wu, Yew-Chung, Chang, Tao-Chih, Duh, Jenq-Gong

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 4.68 MB

english, 2015

44

Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper

Huang, Kuo-Hua, Duh, Jenq-Gong

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 2.15 MB

english, 2015

45

Double-plasma enhanced carbon shield for spatial/interfacial controlled electrodes in lithium ion batteries via micro-sized silicon from wafer waste

Chen, Bing-Hong, Chuang, Shang-I., Duh, Jenq-Gong

Journal:

Journal of Power Sources

Year:

2016

Language:

english

File:

PDF, 3.75 MB

english, 2016

46

Carbon Assisted Technique for Recycled Silicon/Silicon Carbide Composite in Lithium Ion Batteries

Chen, Bing-Hong, Chang, Chun-Chi, Duh, Jenq-Gong

Journal:

Energy Technology

Year:

2016

Language:

english

File:

PDF, 3.52 MB

english, 2016

47

Duplex coating technique to improve the adhesion and tribological properties of CrAlSiN nanocomposite coating

Chang, Chun-Chi, Duh, Jenq-Gong

Journal:

Surface and Coatings Technology

Year:

2016

Language:

english

File:

PDF, 2.48 MB

english, 2016

48

Developing a novel diamine-assisted polymerization method to synthesize nano-LiMnPO4 with N-doped carbon from polyamides for high-performance Li-ion batteries

Yang, Hao, Wang, Yan, Duh, Jenq-Gong

Journal:

ACS Sustainable Chemistry & Engineering

Year:

2018

Language:

english

File:

PDF, 2.84 MB

english, 2018

49

Ultra-thin metallic glass film of Zr–Cu–Ni–Al–N as diffusion barrier for Cu–Si interconnects under fully recrystallized temperature

Kuo, Pei-Hung, Lee, Joseph, Duh, Jenq-Gong

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 1.44 MB

english, 2018

50

Improving shear test performance of SAC305/OSP Cu solder joints by modifying microstructure with minor Ni doping before and after aging

Fleshman, Collin, Song, Rui-wen, Duh, Jenq-Gong

Journal:

Materials Chemistry and Physics

Year:

2020

File:

PDF, 6.11 MB

2020